AMAOE SAM-19 Stencil for Samsung Galaxy S23, S23 Ultra, S24 & S24 Ultra Snapdragon 8 Gen 2 / 8 Gen 3 CPU IC BGA Reballing (0.12mm)

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SKU 178461616561266
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The AMAOE SAM-19 Stencil is a premium 0.12mm BGA reballing stencil designed for Samsung Galaxy S23, S23 Ultra, S24, S24 Ultra, and devices powered by Qualcomm Snapdragon 8 Gen 2 (SM8550) and Snapdragon 8 Gen 3 (SM8650) processors. Manufactured from high-quality Japanese stainless steel, this stencil features precision laser-cut apertures for accurate solder ball placement during CPU, PMIC, and motherboard IC reballing.

Designed for professional mobile repair technicians and electronics service centers, the SAM-19 stencil delivers exceptional durability, heat resistance, and precision, making it the ideal solution for advanced Samsung flagship motherboard repairs.

Key Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA openings
  • 0.12mm thickness for accurate solder ball placement
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade quality
  • Designed for Snapdragon 8 Gen 2 & Snapdragon 8 Gen 3 CPU reballing
  • Suitable for CPU, PMIC, Power IC, and motherboard IC repairs

Compatible Models

  • Samsung Galaxy S23
  • Samsung Galaxy S23 Ultra
  • Samsung Galaxy S24
  • Samsung Galaxy S24 Ultra
  • Qualcomm Snapdragon 8 Gen 2 (SM8550)
  • Qualcomm Snapdragon 8 Gen 3 (SM8650)
  • Compatible PMIC, Power IC, and supporting motherboard IC layouts 

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