AMAOE SAM-18 Stencil for Samsung Galaxy Z Fold5, Z Flip5 Snapdragon 8 Gen 2 CPU IC BGA Reballing (0.12mm)

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The AMAOE SAM-18 Stencil is a professional 0.12mm BGA reballing stencil designed for Samsung Galaxy Z Fold5, Galaxy Z Flip5, and other devices powered by the Qualcomm Snapdragon 8 Gen 2 (SM8550) processor. Made from premium Japanese stainless steel, this stencil features precision laser-cut openings that provide accurate solder ball alignment for CPU, PMIC, Power IC, and motherboard IC reballing.

Engineered for professional mobile repair technicians and electronics service centers, the SAM-18 stencil offers exceptional durability, high-temperature resistance, and consistent reballing accuracy. It is an essential tool for advanced Samsung foldable smartphone motherboard repair and IC replacement.

Key Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA openings
  • 0.12mm thickness for accurate solder ball placement
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade quality
  • Designed for Snapdragon 8 Gen 2 (SM8550) CPU reballing
  • Suitable for CPU, PMIC, Power IC, and motherboard IC repairs

Compatible Models

  • Samsung Galaxy Z Fold5
  • Samsung Galaxy Z Flip5
  • Qualcomm Snapdragon 8 Gen 2 (SM8550)
  • Compatible Samsung PMIC, Power IC, and supporting motherboard IC layouts
  • Suitable for professional Samsung motherboard BGA reballing 

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