The AMAOE SAM-18 Stencil is a professional 0.12mm BGA reballing stencil designed for Samsung Galaxy Z Fold5, Galaxy Z Flip5, and other devices powered by the Qualcomm Snapdragon 8 Gen 2 (SM8550) processor. Made from premium Japanese stainless steel, this stencil features precision laser-cut openings that provide accurate solder ball alignment for CPU, PMIC, Power IC, and motherboard IC reballing.
Engineered for professional mobile repair technicians and electronics service centers, the SAM-18 stencil offers exceptional durability, high-temperature resistance, and consistent reballing accuracy. It is an essential tool for advanced Samsung foldable smartphone motherboard repair and IC replacement.
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