The AMAOE SAM-15 Stencil is a high-precision 0.12mm BGA reballing stencil specially designed for Samsung Galaxy S21, S21+, S21 Ultra, Galaxy Z Flip3, and Galaxy Z Fold3 motherboard and CPU IC repairs. Manufactured from premium Japanese stainless steel, this professional stencil provides exceptional durability, precise solder ball alignment, and consistent reballing performance.
Its precision square-hole design ensures accurate solder ball placement, reducing repair errors and improving efficiency during chip-level repairs. The heat-resistant and reusable construction makes it an essential tool for professional mobile repair technicians, service centers, and electronics repair workshops.
Whether replacing damaged CPU ICs or performing motherboard maintenance, the AMAOE SAM-15 Stencil delivers reliable and professional repair results.
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