The AMAOE SAM-14 BGA Reballing Stencil is a professional-grade stainless steel stencil designed for precise BGA IC reballing and motherboard repair of Samsung Galaxy smartphones. Made from premium Japanese steel with a 0.12mm thickness, it offers excellent durability, accurate solder paste application, and reliable performance for chip-level mobile repairs.
Designed for Samsung Galaxy A10, A20, A30, A40s, and A50, this reusable stencil features precision laser-cut square apertures that ensure accurate solder ball placement and consistent rework results. It is an ideal choice for technicians performing CPU, power IC, and motherboard repairs.
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