AMAOE SAM-13 BGA Reballing Stencil for Samsung A60 / A10s / A70

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SKU 178401565620524
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The AMAOE SAM-13 BGA Reballing Stencil is a high-quality stainless steel stencil specially designed for professional Samsung motherboard and IC repair. It provides accurate solder paste printing and precise BGA reballing, making it an essential tool for repairing Samsung Galaxy A60, A10s, A70 and compatible power management, RF, audio, and CPU ICs.

Manufactured from premium heat-resistant steel, the stencil is laser-cut for excellent alignment, durability, and repeated professional use. It is ideal for mobile repair technicians performing motherboard rework, chip replacement, and SMD soldering. Compatible ICs include PM8958, PM660, PM6150, MT6357CRV, WCN3990, SDM660, SDM450, SM6150, MT6762V, WCD9370, and other supported BGA chips.

Features

  • Premium stainless steel construction
  • Precision laser-cut BGA holes
  • High temperature and corrosion resistant
  • Accurate solder paste application
  • Reusable professional-grade stencil
  • Suitable for Samsung motherboard and IC reballing
  • Ideal for chip-level mobile phone repair

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