The AMAOE S931-012 0.12mm Middle Layer BGA Reballing Stencil is a professional-grade repair stencil designed for the Samsung Galaxy S25 and Samsung Galaxy S25+ series. Precision laser-cut from premium stainless steel, it provides accurate solder ball alignment for CPU, IC, and motherboard reballing, ensuring reliable chip-level repairs.
Ideal for professional mobile repair technicians, this reusable stencil offers excellent heat resistance and durability, making it suitable for repeated rework operations. It is compatible with hot air rework stations and micro-soldering tools, helping improve repair accuracy while reducing servicing time.
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