AMAOE S23FE-012 0.12mm Middle Layer BGA Reballing Stencil for Samsung Galaxy S23 FE (SM-S711B/BE)

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SKU 178401076169955
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The AMAOE S23FE-012 0.12mm Middle Layer BGA Reballing Stencil is a high-precision repair stencil specially designed for the Samsung Galaxy S23 FE (SM-S711B/BE). Made from premium stainless steel, it provides accurate alignment for IC reballing, solder ball planting, and motherboard-level repairs.

With its precision laser-cut hole pattern and durable construction, this stencil delivers reliable performance for chip-level servicing. It is an essential tool for professional mobile repair technicians performing BGA IC rework and motherboard maintenance.

Key Features:

  • Compatible with Samsung Galaxy S23 FE (SM-S711B/BE)
  • Model: AMAOE S23FE-012
  • 0.12mm precision BGA reballing stencil
  • Premium stainless steel construction
  • Precision laser-cut hole design
  • Heat-resistant, durable, and reusable
  • Ideal for IC reballing, solder ball placement, and motherboard repair
  • Suitable for professional mobile repair workshops

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