Amaoe RF3 Stencil for RF IC Chip

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SKU 178385677201105
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The Amaoe RF3 Stencil for RF IC Chip is a professional-grade BGA reballing stencil designed for repairing RF (Radio Frequency) IC chips used in smartphone motherboards. Manufactured from premium Japanese stainless steel, it features precision laser-cut apertures that ensure accurate solder ball placement for reliable and consistent IC reballing.

With a 0.12 mm thickness, excellent heat resistance, and a reusable design, the RF3 stencil is ideal for chip-level motherboard repairs, RF IC replacement, and advanced PCB maintenance. It is suitable for professional mobile repair technicians and electronics service centers that require precision and durability during rework.

Key Features

  • Designed for RF (Radio Frequency) IC chip reballing
  • Premium Japanese stainless steel construction
  • Precision laser-cut openings for accurate solder ball placement
  • 0.12 mm thickness for professional BGA rework
  • Heat-resistant, durable, and reusable
  • Suitable for smartphone motherboard and PCB repair
  • Provides precise alignment for RF IC soldering
  • Ideal for professional mobile repair technicians and service centers

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