AMAOE RF1 Stencil for RF PA IC BGA Reballing

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SKU 178437462880115
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The AMAOE RF1 Stencil is a professional 0.12mm BGA reballing stencil designed for RF (Radio Frequency) Power Amplifier (PA) IC repair and reballing. Manufactured from premium Japanese stainless steel, it features precision laser-cut square apertures that ensure accurate solder ball placement for reliable IC rework.

Designed for professional mobile phone repair technicians, the RF1 stencil delivers excellent heat resistance, superior durability, and consistent reballing performance. It is suitable for repairing RF PA ICs found in smartphones and other wireless communication devices.

Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square holes
  • 0.12mm stencil thickness
  • High heat resistance
  • Reusable and durable
  • Designed for RF Power Amplifier (PA) IC reballing
  • Accurate solder ball alignment
  • Ideal for professional mobile motherboard repair and microsoldering 

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