Amaoe RAM-2 Stencil for Mobile RAM IC Reballing

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SKU 178444828443230
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The Amaoe RAM-2 Stencil is a professional-grade BGA reballing stencil specially designed for mobile RAM and Memory IC reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball placement for reliable RAM IC repair and motherboard maintenance.

The precision square-hole design ensures even solder paste distribution, making it ideal for professional technicians performing memory chip replacement, IC rework, and motherboard repairs. Its durable and reusable construction delivers consistent performance across multiple repair jobs.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for RAM and Memory IC reballing
  • Excellent solder ball alignment
  • Suitable for professional mobile repair technicians

Applications:

  • Mobile RAM IC reballing
  • Memory chip replacement
  • Smartphone motherboard repair
  • BGA IC rework
  • Mobile PCB maintenance
  • Professional repair workshops

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