AMAOE Qualcomm WSR1 Reballing Stencil

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SKU 178411303015487
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The AMAOE Qualcomm WSR1 Reballing Stencil is a high-precision BGA stencil designed for Qualcomm WSR series RF (Radio Frequency) IC reballing and repair. Manufactured from premium Japanese stainless steel with precision laser-cut square holes, it provides accurate solder ball placement and perfect IC alignment for reliable motherboard repairs.

With a 0.12mm thickness, the WSR1 stencil is highly durable, heat-resistant, and reusable, making it an excellent choice for professional mobile phone repair technicians. It is specifically designed for repairing Qualcomm WSR RF ICs used in smartphone motherboards.

Key Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for accurate BGA reballing
  • High-temperature resistant and reusable
  • Designed for Qualcomm WSR series RF ICs
  • Ensures precise solder ball alignment
  • Ideal for professional GSM and mobile motherboard repair

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