The AMAOE Qualcomm WSR1 Reballing Stencil is a high-precision BGA stencil designed for Qualcomm WSR series RF (Radio Frequency) IC reballing and repair. Manufactured from premium Japanese stainless steel with precision laser-cut square holes, it provides accurate solder ball placement and perfect IC alignment for reliable motherboard repairs.
With a 0.12mm thickness, the WSR1 stencil is highly durable, heat-resistant, and reusable, making it an excellent choice for professional mobile phone repair technicians. It is specifically designed for repairing Qualcomm WSR RF ICs used in smartphone motherboards.
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