The Amaoe QU-9 Stencil is a high-precision BGA reballing stencil designed for Qualcomm Snapdragon CPU and IC reballing. Made from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball placement for reliable CPU reballing and advanced motherboard repair.
Its precision square-hole design ensures uniform solder paste application, helping technicians achieve consistent and professional-quality results. The durable, reusable construction makes the QU-9 stencil an ideal choice for CPU replacement, BGA IC repair, and smartphone motherboard servicing.
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