Amaoe QU-9 Stencil for Qualcomm CPU Reballing

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SKU 178446191985303
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The Amaoe QU-9 Stencil is a high-precision BGA reballing stencil designed for Qualcomm Snapdragon CPU and IC reballing. Made from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball placement for reliable CPU reballing and advanced motherboard repair.

Its precision square-hole design ensures uniform solder paste application, helping technicians achieve consistent and professional-quality results. The durable, reusable construction makes the QU-9 stencil an ideal choice for CPU replacement, BGA IC repair, and smartphone motherboard servicing.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for Qualcomm Snapdragon CPU reballing
  • Precise solder ball alignment
  • Ideal for professional motherboard and IC repair

Applications:

  • Qualcomm Snapdragon CPU reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional mobile repair workshops

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