AMAOE QU-8 Qualcomm CPU BGA Reballing Stencil

0 /5.0 (0 reviews)
SKU 178401606985787
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

50 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The AMAOE QU-8 Qualcomm CPU BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate reballing and repair of Qualcomm Snapdragon CPU and RAM ICs. Manufactured from high-grade Japanese steel with a precision 0.12mm thickness, it delivers excellent solder paste printing accuracy for professional motherboard repair.

Featuring precision laser-cut square apertures, the QU-8 stencil ensures perfect alignment and consistent solder ball placement during BGA rework. It is reusable, heat-resistant, and ideal for mobile phone repair technicians performing chip-level motherboard repairs.

Supported Models

  • SM8250 102 CPU
  • SM8250 102 RAM
  • SM8250 002 CPU
  • SM8250 002 RAM
  • SM8350 RAM
  • SM8350 CPU
  • SDM439
  • Compatible Qualcomm Snapdragon CPU & RAM ICs

Features

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square aperture design
  • Heat-resistant and reusable
  • Ideal for Qualcomm Snapdragon CPU and RAM reballing
  • Professional-grade BGA rework stencil for mobile motherboard repair
  • Suitable for chip-level mobile phone servicing

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction