The AMAOE QU-7 Stencil is a premium 0.12mm BGA reballing stencil specially designed for Qualcomm Snapdragon CPU and compatible IC reballing. Manufactured from premium Japanese stainless steel, it features precision laser-cut apertures that provide accurate solder ball alignment for CPU, PMIC, Power IC, and motherboard IC repairs.
Designed for professional mobile phone repair technicians and electronics service centers, the QU-7 stencil delivers excellent heat resistance, superior durability, and consistent performance during advanced BGA rework. It is an essential tool for repairing Qualcomm Snapdragon-powered smartphones with precision and efficiency.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to