AMAOE QU-7 Stencil for Qualcomm CPU IC BGA Reballing (0.12mm)

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SKU 178461769744544
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The AMAOE QU-7 Stencil is a premium 0.12mm BGA reballing stencil specially designed for Qualcomm Snapdragon CPU and compatible IC reballing. Manufactured from premium Japanese stainless steel, it features precision laser-cut apertures that provide accurate solder ball alignment for CPU, PMIC, Power IC, and motherboard IC repairs.

Designed for professional mobile phone repair technicians and electronics service centers, the QU-7 stencil delivers excellent heat resistance, superior durability, and consistent performance during advanced BGA rework. It is an essential tool for repairing Qualcomm Snapdragon-powered smartphones with precision and efficiency.

Key Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA openings
  • 0.12mm thickness for accurate solder ball placement
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade quality
  • Designed for Qualcomm Snapdragon CPU reballing
  • Suitable for CPU, PMIC, Power IC, and motherboard IC repair

Compatible Applications

  • Qualcomm Snapdragon CPU series
  • Qualcomm PMIC and Power IC
  • Android smartphone motherboard repair
  • CPU replacement and IC reballing
  • Professional BGA repair and maintenance
  • Mobile repair workshops and service centers

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