The Amaoe QU-6 Stencil is a high-precision BGA reballing stencil designed for Qualcomm Snapdragon CPU and IC reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it delivers exceptional solder ball alignment for accurate CPU reballing and reliable motherboard repair.
Its precision square-hole design ensures even solder paste distribution, making it ideal for CPU replacement, BGA IC rework, and chipset maintenance. Durable and reusable, the QU-6 stencil is an essential tool for professional mobile phone repair technicians.
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