Amaoe QU-6 Stencil for Qualcomm CPU Reballing

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SKU 178446249203499
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The Amaoe QU-6 Stencil is a high-precision BGA reballing stencil designed for Qualcomm Snapdragon CPU and IC reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it delivers exceptional solder ball alignment for accurate CPU reballing and reliable motherboard repair.

Its precision square-hole design ensures even solder paste distribution, making it ideal for CPU replacement, BGA IC rework, and chipset maintenance. Durable and reusable, the QU-6 stencil is an essential tool for professional mobile phone repair technicians.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for Qualcomm Snapdragon CPU reballing
  • Accurate solder ball positioning
  • Ideal for professional motherboard and IC repair

Applications:

  • Qualcomm Snapdragon CPU reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional mobile repair workshops

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