The Amaoe QU-4 Stencil for Qualcomm CPU Reballing is a high-precision BGA stencil designed for professional repair of Qualcomm Snapdragon CPUs and mobile motherboard ICs. Made from premium Japanese stainless steel with a 0.12mm thickness, it ensures precise solder ball alignment for accurate CPU reballing and IC replacement.
Its precision square-hole design provides uniform solder paste distribution, making it ideal for motherboard repair, chip replacement, and advanced BGA rework. The durable and reusable construction ensures long-lasting performance in professional mobile repair environments.
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