The Amaoe QU-3 0.12mm Stencil is a premium BGA reballing stencil designed for Qualcomm Snapdragon CPU and IC reballing. Manufactured from high-quality Japanese stainless steel with a 0.12mm precision thickness, it provides precise solder ball alignment for reliable CPU rework and smartphone motherboard repair.
Its precision square-hole design ensures even solder paste distribution, improving reballing accuracy and reducing repair time. Durable and reusable, the QU-3 stencil is ideal for professional technicians performing Qualcomm CPU replacement, BGA IC rework, and advanced motherboard servicing.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to