Amaoe QU-3 0.12mm Stencil for Qualcomm CPU Reballing

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SKU 178446217214046
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The Amaoe QU-3 0.12mm Stencil is a premium BGA reballing stencil designed for Qualcomm Snapdragon CPU and IC reballing. Manufactured from high-quality Japanese stainless steel with a 0.12mm precision thickness, it provides precise solder ball alignment for reliable CPU rework and smartphone motherboard repair.

Its precision square-hole design ensures even solder paste distribution, improving reballing accuracy and reducing repair time. Durable and reusable, the QU-3 stencil is ideal for professional technicians performing Qualcomm CPU replacement, BGA IC rework, and advanced motherboard servicing.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for Qualcomm Snapdragon CPU reballing
  • Accurate solder ball positioning
  • Ideal for professional mobile motherboard repair

Applications:

  • Qualcomm Snapdragon CPU reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional mobile repair workshops

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