The AMAOE QU-2 0.12mm Stencil for Qualcomm CPU is a high-precision BGA reballing stencil developed for repairing Qualcomm Snapdragon CPU ICs used in smartphones and other mobile devices. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it offers exceptional durability, precise alignment, and accurate solder ball positioning for professional chip-level repairs.
The precision square-hole design ensures even solder distribution, helping technicians perform reliable and efficient CPU reballing. Its reusable and heat-resistant construction makes it an essential tool for mobile repair shops, service centers, and professional motherboard repair technicians.
Whether you're replacing or reballing Qualcomm processor ICs, the AMAOE QU-2 stencil delivers consistent, high-quality repair results.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to