AMAOE QU-2 0.12mm Stencil for Qualcomm CPU

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SKU 178453390287239
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The AMAOE QU-2 0.12mm Stencil for Qualcomm CPU is a high-precision BGA reballing stencil developed for repairing Qualcomm Snapdragon CPU ICs used in smartphones and other mobile devices. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it offers exceptional durability, precise alignment, and accurate solder ball positioning for professional chip-level repairs.

The precision square-hole design ensures even solder distribution, helping technicians perform reliable and efficient CPU reballing. Its reusable and heat-resistant construction makes it an essential tool for mobile repair shops, service centers, and professional motherboard repair technicians.

Whether you're replacing or reballing Qualcomm processor ICs, the AMAOE QU-2 stencil delivers consistent, high-quality repair results.

Key Features

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for Qualcomm Snapdragon CPU reballing
  • High-accuracy square-hole design
  • Heat-resistant and reusable
  • Excellent solder ball alignment
  • Professional-grade quality
  • Ideal for chip-level motherboard repair
  • Long-lasting and corrosion-resistant

Compatible Chipsets

  • Qualcomm Snapdragon 845
  • Snapdragon 710
  • Snapdragon 670
  • Snapdragon 675
  • Snapdragon 730 / 730G
  • Snapdragon 712
  • Other compatible Qualcomm CPU ICs supported by the stencil layout 

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