The AMAOE QU-1 Stencil is a professional BGA reballing stencil designed for Qualcomm Snapdragon CPU chip repair and reballing. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides precise solder ball alignment and consistent solder paste application for accurate chip-level motherboard repairs. The precision square-hole design ensures clean solder joints and excellent repair reliability.
The QU-1 stencil is specifically designed to support popular Qualcomm Snapdragon processors, including MSM8996, MSM8976, and MSM8992, along with their corresponding RAM layouts. Its reusable, heat-resistant construction makes it ideal for professional mobile repair technicians and service centers performing CPU and RAM reballing.
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