AMAOE PM-3 Stencil for Qualcomm PM Power IC BGA Reballing (0.12mm)

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SKU 178455183115139
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The AMAOE PM-3 Stencil is a professional 0.12mm BGA reballing stencil specially designed for Qualcomm PM Power Management IC (PMIC) reballing and motherboard repair. Manufactured from premium Japanese stainless steel, this stencil features precision laser-cut openings for accurate solder ball placement, ensuring reliable and consistent repair results.

Ideal for professional mobile phone repair technicians and service centers, the PM-3 stencil is designed for repairing Qualcomm PMIC chips used in a wide range of Android smartphones. Its durable construction, excellent heat resistance, and reusable design make it an essential tool for advanced motherboard repair and BGA rework.

Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA openings
  • 0.12mm thickness for precise solder ball alignment
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade quality
  • Designed for Qualcomm PM Power IC (PMIC) reballing
  • Suitable for smartphone motherboard repair and IC replacement

Compatible Applications

  • Qualcomm PM Power Management IC (PMIC)
  • Android smartphone motherboard repair
  • CPU power management IC reballing
  • BGA PMIC replacement and repair
  • Professional mobile phone repair workshops and service centers

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