Amaoe PM-2 Stencil for Qualcomm PM Power IC Reballing

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SKU 178445044618278
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The Amaoe PM-2 Stencil for Qualcomm PM Power IC is a precision BGA reballing stencil designed for repairing Qualcomm Power Management ICs (PMICs) used in modern smartphones. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides accurate solder ball alignment for reliable PMIC reballing and motherboard repair.

Its precision square-hole design ensures uniform solder paste application, making it ideal for Power IC replacement, PMIC maintenance, and advanced motherboard repairs. Built for durability and repeated professional use, the PM-2 stencil is an essential tool for mobile repair technicians.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Specifically designed for Qualcomm PM Power IC reballing
  • Accurate solder ball positioning
  • Ideal for professional motherboard and IC repair

Applications:

  • Qualcomm PMIC (Power Management IC) reballing
  • Power IC replacement
  • Smartphone motherboard repair
  • BGA IC rework
  • Mobile PCB maintenance
  • Professional repair workshops

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