Amaoe P3-012 Huawei P30 Pro 0.12mm Middle Layer Motherboard BGA Reballing Stencil

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SKU 178429234720339
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The Amaoe P3-012 Huawei P30 Pro 0.12mm Middle Layer Motherboard BGA Reballing Stencil is a professional-grade repair tool engineered specifically for the Huawei P30 Pro. Made from premium Japanese steel, it features precision laser-cut square holes that ensure accurate solder ball placement for reliable BGA reballing and motherboard repair.

Its reusable and heat-resistant construction provides excellent durability, making it suitable for professional technicians performing chip-level repairs, motherboard restoration, and PCB maintenance.

Features:

  • Premium Japanese steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for precise BGA reballing
  • Specifically designed for Huawei P30 Pro motherboard repair
  • High heat resistance and reusable construction
  • Accurate solder ball alignment
  • Durable for long-term professional use
  • Ideal for chip-level and motherboard repair applications

Applications:

  • Huawei P30 Pro motherboard repair
  • Middle layer PCB reballing
  • BGA IC rework
  • Mobile phone chip-level repair
  • Professional mobile repair centers

The stencil is manufactured from Japanese steel with a 0.12mm thickness and reusable square-hole design for precision soldering. 

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