The Amaoe P3-012 Huawei P30 Pro 0.12mm Middle Layer Motherboard BGA Reballing Stencil is a professional-grade repair tool engineered specifically for the Huawei P30 Pro. Made from premium Japanese steel, it features precision laser-cut square holes that ensure accurate solder ball placement for reliable BGA reballing and motherboard repair.
Its reusable and heat-resistant construction provides excellent durability, making it suitable for professional technicians performing chip-level repairs, motherboard restoration, and PCB maintenance.
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Applications:
The stencil is manufactured from Japanese steel with a 0.12mm thickness and reusable square-hole design for precision soldering.
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