The Amaoe OV-8 Stencil is a high-precision BGA reballing stencil designed for OPPO and Vivo smartphone CPU and IC reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for reliable motherboard repair and BGA IC replacement.
Featuring a precision square-hole design, the OV-8 stencil ensures uniform solder paste application, making it ideal for CPU reballing, IC replacement, and advanced motherboard maintenance. Its durable and reusable construction makes it an essential tool for professional mobile repair technicians.
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