AMAOE OV-4 Stencil for OPPO & Vivo CPU IC BGA Reballing (0.12mm)

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SKU 178454803105269
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The AMAOE OV-4 Stencil is a premium 0.12mm BGA reballing stencil engineered for OPPO and Vivo smartphone CPU, PMIC, and motherboard IC reballing. Made from high-quality Japanese stainless steel, this stencil features precision laser-cut openings for accurate solder ball placement, ensuring reliable and professional repair results.

Designed for mobile repair technicians and service centers, the OV-4 stencil provides excellent heat resistance, long-lasting durability, and consistent performance during BGA rework. It is an essential tool for repairing OPPO and Vivo smartphone motherboards with precision and efficiency.

Key Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA hole design
  • 0.12mm thickness for accurate solder ball alignment
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade reballing stencil
  • Suitable for CPU, PMIC, and IC reballing
  • Designed for OPPO and Vivo motherboard repairs

Compatible Devices

  • Compatible OPPO smartphone CPU and IC layouts
  • Compatible Vivo smartphone CPU and IC layouts
  • Suitable for CPU, PMIC, Flash IC, and supporting motherboard IC reballing
  • Ideal for professional mobile phone motherboard repair

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