The AMAOE OV-4 Stencil is a premium 0.12mm BGA reballing stencil engineered for OPPO and Vivo smartphone CPU, PMIC, and motherboard IC reballing. Made from high-quality Japanese stainless steel, this stencil features precision laser-cut openings for accurate solder ball placement, ensuring reliable and professional repair results.
Designed for mobile repair technicians and service centers, the OV-4 stencil provides excellent heat resistance, long-lasting durability, and consistent performance during BGA rework. It is an essential tool for repairing OPPO and Vivo smartphone motherboards with precision and efficiency.
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