AMAOE OV-3 Stencil for OPPO & Vivo CPU IC BGA Reballing (0.12mm)

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SKU 178454565505819
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The AMAOE OV-3 Stencil is a professional 0.12mm BGA reballing stencil designed specifically for OPPO and Vivo smartphone CPU and IC reballing. Made from premium Japanese stainless steel, it features precision laser-cut holes for accurate solder ball placement, ensuring reliable and efficient motherboard repair.

This stencil is ideal for repairing OPPO and Vivo logic boards, offering excellent heat resistance, long-lasting durability, and consistent reballing performance. It is an essential tool for mobile repair technicians, service centers, and electronics workshops.

Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA hole design
  • 0.12mm thickness for accurate solder ball alignment
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade quality
  • Ideal for CPU, PMIC, and IC reballing
  • Suitable for OPPO and Vivo motherboard repair

Compatible Devices

  • OPPO smartphones (selected compatible CPU/IC layouts)
  • Vivo smartphones (selected compatible CPU/IC layouts)
  • Compatible OPPO & Vivo CPU, PMIC, and motherboard ICs
  • Suitable for professional BGA reballing and motherboard maintenance

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