The AMAOE OV-1 Stencil for OPPO & Vivo is a professional 0.12mm BGA reballing stencil designed for precise CPU and IC reballing on OPPO and Vivo smartphone motherboards. Manufactured from premium Japanese stainless steel, it provides exceptional durability, accurate solder ball alignment, and consistent performance for professional chip-level repairs.
The precision square-hole design ensures uniform solder ball placement, helping technicians achieve reliable and efficient BGA rework. Its heat-resistant and reusable construction makes it an essential tool for mobile repair shops, service centers, and electronics technicians working on OPPO and Vivo devices.
Whether replacing CPU ICs or repairing damaged motherboards, the AMAOE OV-1 Stencil offers the precision and reliability required for high-quality smartphone repairs.
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