AMAOE OV-1 Stencil for OPPO & Vivo CPU IC Reballing

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SKU 178453548678080
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The AMAOE OV-1 Stencil for OPPO & Vivo is a professional 0.12mm BGA reballing stencil designed for precise CPU and IC reballing on OPPO and Vivo smartphone motherboards. Manufactured from premium Japanese stainless steel, it provides exceptional durability, accurate solder ball alignment, and consistent performance for professional chip-level repairs.

The precision square-hole design ensures uniform solder ball placement, helping technicians achieve reliable and efficient BGA rework. Its heat-resistant and reusable construction makes it an essential tool for mobile repair shops, service centers, and electronics technicians working on OPPO and Vivo devices.

Whether replacing CPU ICs or repairing damaged motherboards, the AMAOE OV-1 Stencil offers the precision and reliability required for high-quality smartphone repairs.

Key Features

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for OPPO & Vivo CPU IC reballing
  • High-precision square-hole design
  • Accurate solder ball positioning
  • Heat-resistant and reusable
  • Durable and corrosion-resistant
  • Professional-grade BGA repair stencil
  • Suitable for chip-level smartphone motherboard repair

Applications

  • OPPO Smartphone Motherboard Repair
  • Vivo Smartphone Motherboard Repair
  • CPU IC Reballing
  • BGA IC Rework
  • Mobile Phone Chip-Level Repair
  • Professional Electronics Repair 

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