AMAOE OP-1 Stencil for OPPO CPU & IC Reballing

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SKU 178436226522679
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The AMAOE OP-1 Stencil is a high-precision BGA reballing stencil designed for OPPO smartphone CPU and IC repair. Manufactured from premium Japanese steel with a 0.12mm thickness, it provides accurate solder ball alignment for reliable chip-level reballing and motherboard repairs. The precision laser-cut square-hole design ensures uniform solder paste application and consistent solder ball placement, making it an essential tool for professional mobile repair technicians. The stencil is reusable, heat-resistant, and built for long-term use.

Features:

  • Designed for OPPO CPU and BGA IC reballing.
  • Premium Japanese stainless steel construction.
  • Precision 0.12mm thickness.
  • High-precision square-hole design.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Ensures accurate solder ball positioning and clean solder joints.
  • Ideal for professional mobile phone motherboard repair. 

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