The AMAOE OP-1 Stencil is a high-precision BGA reballing stencil designed for OPPO smartphone CPU and IC repair. Manufactured from premium Japanese steel with a 0.12mm thickness, it provides accurate solder ball alignment for reliable chip-level reballing and motherboard repairs. The precision laser-cut square-hole design ensures uniform solder paste application and consistent solder ball placement, making it an essential tool for professional mobile repair technicians. The stencil is reusable, heat-resistant, and built for long-term use.
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