The Amaoe MU-6 Stencil is a high-precision BGA reballing stencil designed for MediaTek (MTK) CPU and IC reballing. Crafted from premium Japanese stainless steel with a 0.12mm precision thickness, it ensures accurate solder ball placement for reliable CPU repair, IC replacement, and smartphone motherboard maintenance.
Its precision square-hole design provides uniform solder paste distribution, helping technicians achieve consistent and professional reballing results. The durable, reusable construction makes the MU-6 stencil an essential tool for advanced mobile repair and BGA IC rework.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to