Amaoe MU-5 Stencil for MediaTek (MTK) CPU Reballing

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SKU 178446529601298
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The Amaoe MU-5 Stencil is a premium BGA reballing stencil designed for MediaTek (MTK) CPU and IC reballing. Manufactured from high-quality Japanese stainless steel with a 0.12mm precision thickness, it provides precise solder ball alignment for CPU replacement, IC repair, and professional smartphone motherboard servicing.

Its precision square-hole design ensures even solder paste application, resulting in accurate and reliable BGA reballing. Built for durability and repeated use, the MU-5 stencil is an essential tool for technicians performing advanced mobile motherboard repair and IC rework.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for MediaTek (MTK) CPU reballing
  • Precise solder ball alignment
  • Ideal for professional motherboard and IC repair

Applications:

  • MediaTek (MTK) CPU reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional mobile repair workshops

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