The Amaoe MU-5 Stencil is a premium BGA reballing stencil designed for MediaTek (MTK) CPU and IC reballing. Manufactured from high-quality Japanese stainless steel with a 0.12mm precision thickness, it provides precise solder ball alignment for CPU replacement, IC repair, and professional smartphone motherboard servicing.
Its precision square-hole design ensures even solder paste application, resulting in accurate and reliable BGA reballing. Built for durability and repeated use, the MU-5 stencil is an essential tool for technicians performing advanced mobile motherboard repair and IC rework.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to