The Amaoe MU-4 Stencil is a professional BGA reballing stencil designed for MediaTek (MTK) CPU and IC reballing. Made from premium Japanese stainless steel with a 0.12mm precision thickness, it delivers accurate solder ball placement for reliable CPU repair, IC replacement, and smartphone motherboard servicing.
Its precision square-hole design ensures consistent solder paste application, providing excellent reballing accuracy and dependable repair results. Durable, reusable, and corrosion-resistant, the MU-4 stencil is an essential tool for professional technicians performing advanced mobile motherboard repairs.
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