The Amaoe MU-3 Stencil is a premium-quality BGA reballing stencil designed for MediaTek (MTK) CPU and IC reballing. Made from high-quality Japanese stainless steel with a 0.12mm precision thickness, it ensures accurate solder ball placement for reliable CPU repair and motherboard maintenance.
The precision square-hole design provides uniform solder paste application, improving reballing accuracy and efficiency. Its durable and reusable construction makes it an essential tool for professional technicians performing BGA IC replacement, CPU rework, and mobile motherboard repair.
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