Amaoe MU-3 Stencil for MediaTek (MTK) CPU Reballing

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SKU 178446148476642
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The Amaoe MU-3 Stencil is a premium-quality BGA reballing stencil designed for MediaTek (MTK) CPU and IC reballing. Made from high-quality Japanese stainless steel with a 0.12mm precision thickness, it ensures accurate solder ball placement for reliable CPU repair and motherboard maintenance.

The precision square-hole design provides uniform solder paste application, improving reballing accuracy and efficiency. Its durable and reusable construction makes it an essential tool for professional technicians performing BGA IC replacement, CPU rework, and mobile motherboard repair.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for MediaTek (MTK) CPU reballing
  • Precise solder ball alignment
  • Ideal for professional mobile motherboard repair

Applications:

  • MediaTek (MTK) CPU reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional repair workshops

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