Amaoe MU-2 Stencil for MediaTek (MTK) CPU Reballing

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SKU 178446124583769
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The Amaoe MU-2 Stencil is a precision BGA reballing stencil specifically designed for MediaTek (MTK) CPU and IC reballing. Crafted from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for professional motherboard repair and CPU replacement.

Its precision square-hole design ensures even solder paste distribution, resulting in consistent and reliable reballing performance. The stencil is durable, reusable, and ideal for technicians performing advanced BGA rework on MediaTek-powered smartphones.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for MediaTek (MTK) CPU reballing
  • Precise solder ball positioning
  • Ideal for professional motherboard and IC repair

Applications:

  • MediaTek (MTK) CPU reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional mobile repair workshops

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