The Amaoe MU-2 Stencil is a precision BGA reballing stencil specifically designed for MediaTek (MTK) CPU and IC reballing. Crafted from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for professional motherboard repair and CPU replacement.
Its precision square-hole design ensures even solder paste distribution, resulting in consistent and reliable reballing performance. The stencil is durable, reusable, and ideal for technicians performing advanced BGA rework on MediaTek-powered smartphones.
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