The Amaoe MU-1 Stencil for MediaTek (MTK) CPU is a professional-grade BGA reballing stencil designed for precise CPU and IC rework on MediaTek-powered smartphones. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it ensures accurate solder ball alignment and consistent reballing performance for motherboard repair.
Featuring a precision square-hole layout, the MU-1 stencil provides uniform solder paste application, making it ideal for CPU replacement, IC maintenance, and motherboard servicing. Its durable and reusable design makes it an essential tool for professional mobile repair technicians.
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