Amaoe MU-1 Stencil for MediaTek (MTK) CPU Reballing

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SKU 178452903866599
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The Amaoe MU-1 Stencil is a professional BGA reballing stencil engineered for MediaTek (MTK) CPU and IC reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for CPU replacement, IC repair, and smartphone motherboard maintenance.

Its precision square-hole design ensures uniform solder paste application, delivering reliable and consistent BGA reballing results. The durable, reusable, and corrosion-resistant construction makes it an essential tool for professional mobile repair technicians performing advanced motherboard and chipset repairs.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for MediaTek (MTK) CPU reballing
  • Precise solder ball alignment
  • Ideal for professional motherboard and IC repair

Applications:

  • MediaTek (MTK) CPU reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional mobile repair workshops

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