The Amaoe MU-1 Stencil is a professional BGA reballing stencil engineered for MediaTek (MTK) CPU and IC reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for CPU replacement, IC repair, and smartphone motherboard maintenance.
Its precision square-hole design ensures uniform solder paste application, delivering reliable and consistent BGA reballing results. The durable, reusable, and corrosion-resistant construction makes it an essential tool for professional mobile repair technicians performing advanced motherboard and chipset repairs.
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