The Amaoe MQ-6 Stencil is a professional-grade BGA reballing stencil designed for MediaTek (MTK) and Qualcomm Snapdragon CPU reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for CPU replacement, IC rework, and advanced smartphone motherboard repair.
Its precision square-hole design ensures uniform solder paste distribution, delivering reliable and consistent reballing performance. The durable and reusable construction makes the MQ-6 stencil an essential tool for professional mobile repair technicians working on a wide range of Android smartphones.
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