Amaoe MQ-6 Stencil for MediaTek & Qualcomm CPU Reballing

0 /5.0 (0 reviews)
SKU 178446318812157
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

49 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The Amaoe MQ-6 Stencil is a professional-grade BGA reballing stencil designed for MediaTek (MTK) and Qualcomm Snapdragon CPU reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for CPU replacement, IC rework, and advanced smartphone motherboard repair.

Its precision square-hole design ensures uniform solder paste distribution, delivering reliable and consistent reballing performance. The durable and reusable construction makes the MQ-6 stencil an essential tool for professional mobile repair technicians working on a wide range of Android smartphones.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for MediaTek and Qualcomm CPU reballing
  • Precise solder ball alignment
  • Ideal for professional motherboard and IC repair

Applications:

  • MediaTek (MTK) CPU reballing
  • Qualcomm Snapdragon CPU reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • CPU and chipset repair
  • Professional mobile repair workshops

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction