The AMAOE MQ-5 Stencil for MTK & Qualcomm CPU is a professional-grade BGA reballing stencil designed for precise CPU repair and reballing of MediaTek and Qualcomm chipsets. Manufactured from high-quality Japanese steel with a 0.12mm thickness, it provides excellent durability, accurate alignment, and consistent solder ball placement for advanced motherboard repairs. Its square-hole design ensures clean solder distribution, making it ideal for professional mobile repair technicians.
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