The AMAOE MQ-4 Stencil for MTK & Qualcomm CPU is a high-precision BGA reballing stencil designed for professional mobile motherboard repair. Manufactured from premium Japanese steel with a 0.12mm thickness, it offers excellent durability, precise alignment, and accurate solder ball placement. Its square-hole design ensures even solder distribution, making it an ideal tool for repairing MediaTek and Qualcomm CPU ICs.
This reusable stencil is suitable for technicians performing advanced CPU reballing and motherboard maintenance, delivering reliable and consistent repair results.
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