The Amaoe MQ-3 Stencil for MTK / Qualcomm CPU is a high-precision BGA reballing stencil designed for professional mobile phone motherboard repair. Manufactured from premium Japanese steel with a 0.12mm thickness, it provides excellent durability, precise solder ball alignment, and long service life. The square-hole design ensures accurate solder paste application, making it ideal for CPU and RAM reballing on Qualcomm and MediaTek chipsets. The stencil is reusable and suitable for advanced mobile repair technicians.
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