Amaoe MQ-3 Stencil for MTK / Qualcomm CPU

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SKU 178437728668483
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The Amaoe MQ-3 Stencil for MTK / Qualcomm CPU is a high-precision BGA reballing stencil designed for professional mobile phone motherboard repair. Manufactured from premium Japanese steel with a 0.12mm thickness, it provides excellent durability, precise solder ball alignment, and long service life. The square-hole design ensures accurate solder paste application, making it ideal for CPU and RAM reballing on Qualcomm and MediaTek chipsets. The stencil is reusable and suitable for advanced mobile repair technicians.

Features:

  • Premium Japanese steel construction
  • 0.12mm precision thickness
  • Super hard and durable
  • Reusable design
  • Square aperture for accurate solder ball placement
  • Ideal for CPU, RAM, and motherboard IC reballing
  • Suitable for professional mobile repair workshops

Supported Models:

  • SM8250 RAM
  • SM8250 CPU
  • MT6885Z RAM
  • MT6885Z CPU
  • Snapdragon 865
  • SM6125
  • SM7250
  • SM7150 

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