The Amaoe MQ-2 Stencil for MTK / Qualcomm CPU is a premium-quality BGA reballing stencil designed for professional mobile phone repair technicians. Manufactured from durable Japanese steel with a precision 0.12mm thickness, it provides accurate solder ball alignment for CPU and Power IC reballing. The stencil features square apertures for consistent solder paste application and can be reused multiple times without losing accuracy.
It supports a range of MediaTek and Qualcomm chipsets, making it an ideal tool for motherboard repair, CPU replacement, and IC rework in Android smartphones.
Features:
Supported Chipsets:
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