The AMAOE MQ-1 Stencil for MTK & Qualcomm CPU is a professional-grade 0.12mm BGA reballing stencil designed for precise reballing and repair of MediaTek (MTK) and Qualcomm Snapdragon CPU ICs. Made from premium Japanese stainless steel, it delivers excellent durability, precise solder ball alignment, and consistent performance during chip-level motherboard repairs.
Its high-precision square-hole design ensures even solder distribution, making CPU reballing faster, cleaner, and more reliable. The stencil is reusable, heat-resistant, and ideal for professional mobile phone repair technicians, service centers, and electronics repair workshops.
Whether you're repairing smartphone motherboards or replacing damaged CPU ICs, the AMAOE MQ-1 stencil provides the accuracy and reliability required for professional BGA rework.
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