AMAOE MQ-1 Stencil for MTK & Qualcomm CPU

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SKU 178453484895679
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The AMAOE MQ-1 Stencil for MTK & Qualcomm CPU is a professional-grade 0.12mm BGA reballing stencil designed for precise reballing and repair of MediaTek (MTK) and Qualcomm Snapdragon CPU ICs. Made from premium Japanese stainless steel, it delivers excellent durability, precise solder ball alignment, and consistent performance during chip-level motherboard repairs.

Its high-precision square-hole design ensures even solder distribution, making CPU reballing faster, cleaner, and more reliable. The stencil is reusable, heat-resistant, and ideal for professional mobile phone repair technicians, service centers, and electronics repair workshops.

Whether you're repairing smartphone motherboards or replacing damaged CPU ICs, the AMAOE MQ-1 stencil provides the accuracy and reliability required for professional BGA rework.

Key Features

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for MTK & Qualcomm CPU reballing
  • High-precision square-hole design
  • Accurate solder ball positioning
  • Heat-resistant and reusable
  • Durable and corrosion-resistant
  • Suitable for professional chip-level motherboard repair
  • Ideal for smartphone and tablet motherboard servicing

Applications

  • MediaTek (MTK) CPU IC Reballing
  • Qualcomm Snapdragon CPU Repair
  • Smartphone Motherboard Repair
  • BGA IC Rework
  • Mobile Phone Chip-Level Repair
  • Professional Electronics Repair

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