The AMAOE MP1 Stencil is a high-precision BGA reballing stencil designed for repairing Qualcomm, MediaTek (MTK), and PM Power ICs used in smartphones and other mobile devices. Manufactured from premium Japanese steel with precision laser-cut apertures, it ensures accurate solder ball alignment for reliable IC reballing and motherboard repair.
Its durable 0.12 mm stainless steel construction offers excellent heat resistance and can be reused multiple times, making it an essential tool for professional mobile repair technicians.
Features:
Supported ICs include:
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