AMAOE MP1 Stencil for Qualcomm / MTK / PM Power IC Reballing

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SKU 178437162911183
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The AMAOE MP1 Stencil is a high-precision BGA reballing stencil designed for repairing Qualcomm, MediaTek (MTK), and PM Power ICs used in smartphones and other mobile devices. Manufactured from premium Japanese steel with precision laser-cut apertures, it ensures accurate solder ball alignment for reliable IC reballing and motherboard repair.

Its durable 0.12 mm stainless steel construction offers excellent heat resistance and can be reused multiple times, making it an essential tool for professional mobile repair technicians.

Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square holes
  • Thickness: 0.12 mm
  • High heat resistance
  • Reusable and durable
  • Ideal for Qualcomm, MTK, and PM Power IC reballing
  • Suitable for professional mobile motherboard repair

Supported ICs include:

  • MT6355W
  • MT6356W
  • MT6357V / MT6357CRV
  • MT6358W
  • MT6336WP
  • PM660
  • PM6604/L
  • PM670
  • PM670A/L
  • PM540
  • PM640
  • PM845
  • PMI632
  • MP6335WP
  • MT6370P
  • MT6371P and other compatible Qualcomm & MediaTek Power ICs. 

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