The Amaoe MP-2 Stencil for Qualcomm & MediaTek PM Power IC is a professional-grade BGA reballing stencil designed for accurate reballing of Power Management ICs (PMICs) used in Qualcomm and MediaTek smartphones. Made from premium Japanese steel with a precision 0.12mm thickness, this stencil provides excellent durability, precise solder ball alignment, and consistent performance for motherboard repair and IC rework.
Its precision square-hole design ensures uniform solder paste application, making it an essential tool for technicians performing PMIC replacement and mobile motherboard repairs.
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