Amaoe MP-2 Stencil for Qualcomm & MediaTek PM Power IC

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SKU 178437933939702
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The Amaoe MP-2 Stencil for Qualcomm & MediaTek PM Power IC is a professional-grade BGA reballing stencil designed for accurate reballing of Power Management ICs (PMICs) used in Qualcomm and MediaTek smartphones. Made from premium Japanese steel with a precision 0.12mm thickness, this stencil provides excellent durability, precise solder ball alignment, and consistent performance for motherboard repair and IC rework.

Its precision square-hole design ensures uniform solder paste application, making it an essential tool for technicians performing PMIC replacement and mobile motherboard repairs.

Features:

  • Premium Japanese steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable and reusable
  • Designed for Qualcomm & MediaTek PM Power IC reballing
  • Ideal for professional motherboard and IC repair
  • Provides precise solder ball positioning

Compatible ICs:

  • Qualcomm PM Power ICs
  • MediaTek PMICs
  • Various Android smartphone Power Management ICs

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