The AMAOE MI12 Layer Stencil is a high-precision 0.12mm BGA reballing stencil designed for Xiaomi 12, Xiaomi 12 Pro, and Redmi K50 motherboard and middle-layer repair. Manufactured from premium stainless steel, it features precision laser-cut openings that provide accurate solder ball alignment and uniform solder paste application for reliable chip-level repairs.
This reusable stencil is ideal for CPU reballing, IC replacement, motherboard restoration, and PCB maintenance. Its durable, heat-resistant, and corrosion-resistant construction ensures long-lasting performance, making it an essential tool for professional mobile repair technicians.
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