AMAOE MI1 Stencil for Xiaomi & Redmi CPU IC BGA Reballing

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SKU 178437611769020
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The AMAOE MI1 Stencil is a professional 0.12mm BGA reballing stencil specially designed for Xiaomi and Redmi smartphone CPU IC repair. Manufactured from premium Japanese stainless steel, it features precision laser-cut square apertures that provide accurate solder ball alignment for CPU and BGA IC reballing.

Designed for professional mobile repair technicians, the MI1 stencil offers excellent heat resistance, durability, and consistent performance during motherboard-level repairs. Its reusable construction makes it an essential tool for repairing Xiaomi and Redmi logic boards.

Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square holes
  • 0.12mm thickness for accurate BGA reballing
  • High heat resistance and anti-deformation design
  • Durable and reusable
  • Ideal for Xiaomi and Redmi CPU IC reballing
  • Suitable for motherboard repair and microsoldering
  • Professional-grade mobile phone repair tool

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