The Amaoe MI Note 9 Pro BGA Reballing Stencil (0.12mm) is a high-precision reballing stencil designed specifically for the Xiaomi Mi Note 9 Pro smartphone motherboard. Manufactured from premium Japanese stainless steel, it features precision laser-cut apertures that ensure accurate solder ball placement for professional BGA IC reballing and chip-level repairs.
With a 0.12 mm thickness, this stencil offers excellent heat resistance, durability, and dimensional stability, making it ideal for repeated use in professional repair workshops. It is suitable for motherboard restoration, CPU and IC rework, and advanced PCB maintenance, providing technicians with reliable alignment and efficient soldering performance.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to