Amaoe MI Note 9 Pro BGA Reballing Stencil (0.12mm)

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SKU 178400811331154
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The Amaoe MI Note 9 Pro BGA Reballing Stencil (0.12mm) is a high-precision reballing stencil designed specifically for the Xiaomi Mi Note 9 Pro smartphone motherboard. Manufactured from premium Japanese stainless steel, it features precision laser-cut apertures that ensure accurate solder ball placement for professional BGA IC reballing and chip-level repairs.

With a 0.12 mm thickness, this stencil offers excellent heat resistance, durability, and dimensional stability, making it ideal for repeated use in professional repair workshops. It is suitable for motherboard restoration, CPU and IC rework, and advanced PCB maintenance, providing technicians with reliable alignment and efficient soldering performance.

Key Features

  • Designed for Xiaomi Mi Note 9 Pro motherboard repair
  • Precision BGA reballing stencil with laser-cut openings
  • Premium Japanese stainless steel construction
  • 0.12 mm thickness for accurate solder ball placement
  • Heat-resistant, durable, and reusable
  • Suitable for CPU, IC, and motherboard rework
  • Easy alignment for precise chip-level repairs
  • Ideal for professional mobile repair technicians and service centers

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