Amaoe MI-8 Stencil for Xiaomi Redmi Series

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SKU 178437964229234
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The Amaoe MI-8 Stencil for Xiaomi Redmi Series is a high-precision BGA reballing stencil specially designed for repairing Xiaomi and Redmi smartphone motherboards. Made from premium Japanese steel with a 0.12mm thickness, this stencil offers precise solder ball alignment for CPU and IC reballing, ensuring reliable repair results.

Its durable, reusable construction and precision square-hole design make it an essential tool for professional technicians performing motherboard repair, CPU replacement, and BGA IC rework on Xiaomi Redmi devices.

Features:

  • Premium Japanese steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable and reusable
  • Ideal for CPU and BGA IC reballing
  • Perfect for Xiaomi and Redmi motherboard repair
  • Professional-grade mobile phone repair tool

Compatible Devices:

  • Xiaomi Redmi Series smartphones
  • Supported Xiaomi/Redmi CPU and IC layouts as specified by the MI-8 stencil
  • Suitable for professional BGA reballing and motherboard repair

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