The AMAOE MI-7 BGA Reballing Stencil is a high-precision repair stencil designed for multiple Xiaomi and Redmi smartphone models, including Redmi Y2, Mi 4, Mi 4A, Redmi 5A, and Mi A1. Made from premium stainless steel, it offers accurate alignment for BGA IC reballing, solder ball placement, and motherboard-level repairs.
Its precision laser-cut hole pattern ensures reliable soldering results while reducing alignment errors during chip-level servicing. The stencil is heat-resistant, durable, and reusable, making it an essential tool for professional mobile phone repair technicians.
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