Amaoe MI-6 Stencil for Xiaomi Redmi CPU Reballing

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SKU 178438011685261
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The Amaoe MI-6 Stencil for Xiaomi Redmi CPU Reballing is a professional BGA reballing stencil designed for accurate CPU and IC repair on Xiaomi and Redmi smartphones. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it delivers excellent durability, precise solder ball positioning, and consistent reballing results.

Designed for professional mobile repair technicians, the MI-6 stencil features a precision square-hole layout that ensures accurate solder paste application and reliable CPU reballing. Its reusable construction makes it an essential tool for motherboard repairs and BGA IC replacement.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, corrosion-resistant, and reusable
  • Ideal for CPU and BGA IC reballing
  • Designed for Xiaomi and Redmi motherboard repair
  • Professional-grade mobile repair tool

Applications:

  • Xiaomi smartphone motherboard repair
  • Redmi CPU reballing
  • BGA IC replacement
  • Mobile PCB maintenance
  • Professional mobile repair workshops

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