The Amaoe MI 25 Ultra Middle Layer Reballing Stencil is a precision-engineered BGA reballing stencil designed for Xiaomi 15 Ultra smartphone motherboard repair. Manufactured from premium Japanese stainless steel, it features precision laser-cut openings that ensure accurate solder ball placement and reliable middle-layer reballing.
With a 0.12 mm thickness, this stencil offers excellent heat resistance, dimensional stability, and long-lasting durability for repeated professional use. It is ideal for chip-level motherboard repair, middle-layer PCB rework, and BGA IC maintenance. The reusable design helps technicians achieve precise alignment, improved repair efficiency, and high-quality soldering results.
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