Amaoe MI 25 Ultra Middle Layer Reballing Stencil

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SKU 178385374569805
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The Amaoe MI 25 Ultra Middle Layer Reballing Stencil is a precision-engineered BGA reballing stencil designed for Xiaomi 15 Ultra smartphone motherboard repair. Manufactured from premium Japanese stainless steel, it features precision laser-cut openings that ensure accurate solder ball placement and reliable middle-layer reballing.

With a 0.12 mm thickness, this stencil offers excellent heat resistance, dimensional stability, and long-lasting durability for repeated professional use. It is ideal for chip-level motherboard repair, middle-layer PCB rework, and BGA IC maintenance. The reusable design helps technicians achieve precise alignment, improved repair efficiency, and high-quality soldering results.

Key Features

  • Specially designed for Xiaomi 15 Ultra middle-layer motherboard repair
  • Premium Japanese stainless steel construction
  • Precision laser-cut holes for accurate solder ball placement
  • 0.12 mm thickness for professional BGA reballing
  • Heat-resistant, durable, and reusable
  • Ideal for motherboard, CPU, and BGA IC repair
  • Lightweight and easy to align during rework
  • Suitable for professional mobile repair technicians and service centers

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