The Amaoe MI-2 Stencil is a professional-grade BGA reballing stencil designed for Xiaomi Mi 2, Mi 3, Mi 4, and compatible Qualcomm-based smartphones. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for CPU and IC reballing during advanced motherboard repairs.
Its precision square-hole design ensures even solder paste distribution, delivering reliable and consistent reballing results. The stencil is durable, reusable, and ideal for technicians performing CPU replacement, BGA IC repair, and smartphone motherboard maintenance.
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