Amaoe MI-2 Stencil for Xiaomi Mi 2, Mi 3 & Mi 4 CPU Reballing

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SKU 178445019455712
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The Amaoe MI-2 Stencil is a professional-grade BGA reballing stencil designed for Xiaomi Mi 2, Mi 3, Mi 4, and compatible Qualcomm-based smartphones. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball alignment for CPU and IC reballing during advanced motherboard repairs.

Its precision square-hole design ensures even solder paste distribution, delivering reliable and consistent reballing results. The stencil is durable, reusable, and ideal for technicians performing CPU replacement, BGA IC repair, and smartphone motherboard maintenance.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for Qualcomm CPU reballing
  • Precise solder ball positioning
  • Suitable for professional mobile motherboard repair

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